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Leading-Edge Chips

Who leads the race to the smallest, densest chips?

Live Updated 2025-12

Distance to goal

The single most intuitive view — current position against the end goal, on a log scale.

Leading node in volume production

Metric detail
now
2nm
TSMC (N2)
goal
~0.0 orders of magnitude to go

Headline indicators

Who leads

Standings by actor, within this field only.

Leading node

Metric detail
TSMCN2, volume leader2nm
Samsung FoundrySF2 (GAA)2nm
Intel18A, 2nm-class2nm
SMICno EUV access7nm

Foundry share

Metric detail
TSMC~2/3 of the market67%
Samsung Foundrydistant second8%
SMICChina's largest6%
IntelIntel Foundry, ramping1%
TSMC~$40B (2025 guidance)$40B
Intelreported$18B
Samsung Foundryfoundry, reported$15B

Milestone timeline

Clear-cut events: crossed or not crossed.

5 achieved 0 in progress 1 locked

EUV lithography reaches volume production

2019
ASML / TSMC

TSMC's 7nm+ became the first high-volume node using ASML's extreme-ultraviolet machines — the tool that unlocked everything below 7nm.

First gate-all-around (GAA) node

2022-06
Samsung

Samsung's 3nm was the first to ship GAA transistors, the architecture now succeeding FinFET at the frontier.

HBM3E ships for AI accelerators

2024
SK hynix

High-bandwidth memory became the other scarce frontier part, with SK hynix leading supply for AI GPUs.

2nm-class volume production begins

2025-12
TSMC / Samsung / Intel

All three leaders entered 2nm-class volume in 2025 (TSMC N2 in Q4); demand outstrips supply, with long foundry waitlists.

Backside power delivery reaches volume

2025-11
Intel (18A)

Intel's 18A brought PowerVia backside power to a volume node — a structural change rivals are still adopting.

1.4nm-class node in volume

~ 2028+

The next frontier (TSMC A14, Intel 14A, Samsung SF1.4), with High-NA EUV — targeted around 2028, not yet here.

Related news & analysis

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Every figure links to a primary source. We publish no invented scores. Tracker numbers are neutral; analysis is labelled separately.