Qualcomm's HBC is now working silicon: stacked LPDDR on a compute die, aimed at the cost of moving data
Qualcomm says first-generation High Bandwidth Compute, the stacked-LPDDR memory with an inference engine in its base die that it unveiled in June, has passed silicon validation in its San Diego lab with full read-write and near-memory compute. It quotes 133 TB/s of total memory bandwidth for the AI250 card, 18x the LPDDR5X on today's AI200, with samples due in the first half of 2027.